Introduction of Kunshan Ruizhengyuan Electronics: What are the characteristics of stamping with carrier tape?

Stamping process of carrier tape is the core process of electronic component packaging carrier tape production. It is mainly used to manufacture carrier tape for carrying micro components such as resistors, capacitors and IC chips, and it is suitable for SMT production line. Its process features focus on high precision, high efficiency and high consistency, as follows:

Ultra-high precision machining, adapting micro components

The core of punching carrier tape is to punch positioning holes, conveying holes and component accommodating cavities on the base tape (paper or plastic base tape), and the dimensional tolerance should be controlled within * * 0.01 ~ 0.05 mm * * to match the high-speed and accurate picking and placing of SMT equipment.

For micro-IC, precision sensor and other components, it is necessary to punch the special-shaped receiving cavity, which requires extremely high mold accuracy and stamping stroke control to avoid the deformation of cavity wall and burr exceeding the standard to affect the component loading.

High-speed continuous stamping to meet large-scale production

The continuous roll-to-roll stamping mode is adopted, the baseband is accurately stepped by the feeding mechanism, and hundreds of punches per minute are realized with the high-speed punch. The daily production capacity of a single production line can reach tens of thousands of meters, which is suitable for the mass supply demand of the electronics industry.

Stamping is linked with subsequent cutting and winding processes to realize integrated production, reduce intermediate transfer links and improve production efficiency.

The material has strong adaptability and covers various types of carrier tapes.

Different substrates such as paper carrier tape (kraft paper, white cardboard) and plastic carrier tape (PS, PC, ABS, PET) can be processed, and different material characteristics can be adapted by adjusting stamping pressure and die gap. For example, paper carrier tape needs to control pressure to prevent tearing, and plastic carrier tape needs to avoid substrate deformation caused by high temperature.

Support the stamping process of single-layer and double-layer composite carrier tape, and meet the protection requirements of different packaging components.

High consistency and stability, ensuring automation adaptability

In the stamping process, the on-line inspection system is used to monitor the hole spacing and the size of the receiving cavity in real time, and the high-precision guiding design of the die is combined to ensure the dimensional consistency of the whole roll of carrier tape and avoid the SMT production line from being stuck or stopped due to errors.

Servo-driven punching machine is adopted, the punching stroke and speed can be accurately adjusted, which reduces the vibration and noise in the punching process and further improves the machining stability.

The process integration is high, and the subsequent processes are simplified.

Some advanced production lines can realize the integration of stamping+punching+laminating, complete the processing of positioning holes while stamping the accommodation cavity, and cover the upper cover tape (heat sealing film) synchronously, directly produce the finished carrier tape which can be used for component packaging, and shorten the production process.

Strict requirements for molds and equipment.

The stamping die should be made of wear-resistant materials such as cemented carbide, and the die life and machining accuracy should be ensured by precision grinding. The gap between the cutting edges of the die needs to be accurately adjusted according to the thickness of the base material, otherwise, defects such as burr and indentation will easily occur.

Punch press should be equipped with high-precision feeding mechanism and tension control system to prevent baseband deviation and stretching deformation from affecting stamping quality.