Introduce in detail: what are the characteristics of stamping parts processing of electronic products?

You have a good grasp of this question! The core characteristics of stamping parts of electronic products are high precision, high efficiency and large scale. At the same time, it is one of the core molding processes in electronic manufacturing industry to adapt to the characteristics of "light weight and small density" of electronic parts and give consideration to material utilization and cost control.

First, the machining accuracy is high, and it meets the precise requirements of electronic parts.

Strict dimensional tolerance control: electronic stamping parts are mostly micro or small parts (such as connector terminals and mobile phone middle frame buckles), and the dimensional tolerance can be stably controlled within ±0.01-0.05mm, and some high-precision parts even reach ±0.005mm, which meets the requirements of highly integrated assembly of electronic equipment.

Excellent surface quality: the stamping process is formed by precision die, and the surface of the part has no cutting marks, and the roughness can be controlled at Ra≤0.8μm, which directly adapts to the appearance and conductive contact requirements of electronic equipment (such as battery pole pieces and circuit board pins) without additional polishing treatment.

Stable form and position accuracy: the mold has high guiding accuracy, which can guarantee the form and position tolerances of parts such as flatness, parallelism and verticality, and avoid the influence of parts deformation on the assembly accuracy of electronic equipment (such as camera bracket and RF antenna shrapnel).

Second, the processing efficiency is high, which is suitable for large-scale mass production.

High-speed continuous processing: High-speed punching machine (the stroke can reach 300-1000 times per minute) combined with multi-position progressive die can realize integrated continuous processing of feeding, punching, trimming, bending and other processes. The daily average production capacity of a single device can reach tens of thousands to hundreds of thousands, which is suitable for mass production of consumer electronics (such as mobile phone buttons and earphone net covers).

High degree of automation: it can be matched with automatic feeder, waste recycling device and CCD detection system to realize automatic production of the whole process, reduce manual intervention, reduce human error and improve production safety (such as micro-sensor shell stamping).

Process integration: through compound die or progressive die, multiple processing steps are integrated into one process (such as punching+bending+flanging), which shortens the production process, reduces the turnover loss of parts and improves the production efficiency.

Third, the material is widely adaptable, giving consideration to performance and cost.

Adapting electronic special materials: It can process all kinds of common materials in electronic industry, including copper/aluminum/stainless steel and other metal sheets (thickness 0.05-2.0mm), conductive alloys (such as phosphor bronze and brass), elastic materials (such as beryllium copper and spring steel) and non-metallic materials (such as PET film and insulating paper), so as to meet different functional requirements such as electrical conductivity, thermal conductivity, insulation and elasticity.

High material utilization rate: By optimizing the layout design of the die (such as nesting layout and staggered layout), the material utilization rate can be increased to 80%-95%, which reduces the generation of waste materials, especially suitable for processing precious metals (such as copper and beryllium copper) and reduces the material cost (such as punching copper foil of connector terminals and circuit boards).

Suitable for thin material processing: He is good at processing metal foil as thin as 0.01mm, and avoids problems such as stretching, wrinkling and tearing (such as battery tab and flexible printed circuit board reinforcing sheet) during thin material processing through precision die and micro-stamping technology.

Fourth, the process is flexible and adapts to the needs of complex structures.

Multi-process combination: It can be combined with punching, bending, stretching, flanging, punching, riveting and other stamping processes to process complex irregular structures (such as concave-convex buckle of mobile phone middle frame and multi-step structure of RF connector) to meet the diversified design requirements of electronic parts.

Micro-stamping adaptation: For micro-electronic parts (such as micro-motor cores and sensor pins), micro-stamping technology can be used in conjunction with high-precision micro-dies to realize the precise machining of micro-aperture (≥0.1mm) and narrow slit (≥0.05mm).

Customization and adaptation: the mold can be changed flexibly, and different parts models can be switched quickly, which adapts to the characteristics of fast product update iteration in the electronics industry (such as rapid mass production of new consumer electronics accessories and customized sensor shell processing).

Five, the cost advantage is remarkable, and it adapts to the cost performance requirements of the industry.

Low cost of mass production: after the mold is put into use once, the processing cost of a single piece in subsequent mass production is extremely low, which is especially suitable for mass production scale above one million. Compared with CNC milling, turning and other processing methods, the cost can be reduced by 30%-70% (such as ordinary electronic hardware accessories).

Long service life of dies: electronic stamping dies are made of high-quality die steel such as cemented carbide and SKD11. After heat treatment, they have high hardness and strong wear resistance, and the service life can reach hundreds of thousands to millions of times, further diluting the cost of individual pieces (such as standardized connector terminal dies).

Simplification of post-processing: Most parts after stamping can be directly assembled without complicated post-processing (such as electroplating and polishing can be integrated in the post-stamping process), thus reducing the overall processing flow cost.